Title :
High microwave and noise performance of 0.17-μm AlGaN-GaN HEMTs on high-resistivity silicon substrates
Author :
Minko, A. ; Hoel, Virginie ; Lepilliet, S. ; Dambrine, G. ; De Jaeger, J.C. ; Cordier, Y. ; Semond, F. ; Natali, F. ; Massies, J.
Author_Institution :
GaN Electron. Res. Group, Univ. Lille, Villeneuve d´Ascq, France
fDate :
4/1/2004 12:00:00 AM
Abstract :
AlGaN-GaN high-electron mobility transistors (HEMTs) based on high-resistivity silicon substrate with a 0.17-μm T-shape gate length are fabricated. The device exhibits a high drain current density of 550 mA/mm at V/sub GS/=1 V and V/sub DS/=10 V with an intrinsic transconductance (g/sub m/) of 215 mS/mm. A unity current gain cutoff frequency (fT) of 46 GHz and a maximum oscillation frequency (fmax) of 92 GHz are measured at V/sub DS/=10 V and I/sub DS/=171 mA/mm. The radio-frequency microwave noise performance of the device is obtained at 10 GHz for different drain currents. At V/sub DS/=10 V and I/sub DS/=92 mA/mm, the device exhibits a minimum-noise figure (NFmin) of 1.1 dB and an associated gain (G/sub ass/) of 12 dB. To our knowledge, these results are the best fT, fmax and microwave noise performance ever reported on GaN HEMT grown on Silicon substrate.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; microwave field effect transistors; semiconductor device noise; wide band gap semiconductors; 0.17 micron; 1 V; 1.1 dB; 10 GHz; 10 V; 12 dB; 46 GHz; 92 GHz; AlGaN-GaN; HEMT; T-shape gate; drain current density; drain currents; high-electron mobility transistors; high-resistivity silicon substrate; high-resistivity silicon substrates; intrinsic transconductance; microwave performance; minimum-noise figure; oscillation frequency; radio-frequency microwave noise performance; unity current gain cutoff frequency; Aluminum gallium nitride; Current density; Current measurement; Cutoff frequency; Frequency measurement; HEMTs; MODFETs; Microwave devices; Silicon; Transconductance;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2004.825208