DocumentCode :
940130
Title :
Effects of deposition conditions on stoichiometry of off-axis RF sputtered BiSrCaCuO thin films
Author :
Yang, Y.F. ; Nordman, J.E. ; Lee, J.U.
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Volume :
3
Issue :
1
fYear :
1993
fDate :
3/1/1993 12:00:00 AM
Firstpage :
1543
Lastpage :
1546
Abstract :
The composition of as-grown BiSrCaCuO superconducting thin films has been investigated as a function of the RF magnetron sputtering variables, i.e. total sputtering pressure, substrate temperature, and oxygen partial pressure in an off-axis configuration. This study shows that use of off-axis geometry alone is insufficient to completely overcome the resputtering problem due to energetic particle bombardment on the substrate. The bismuth loss in the sputtered films at low sputtering pressure and copper loss at high pressure, both of which were aggravated at increasing temperatures, were observed. The mechanisms of thermally enhanced resputtering and gas scattering effects at high pressure are proposed to interpret the discrepancy between target and film composition.<>
Keywords :
bismuth compounds; calcium compounds; high-temperature superconductors; sputtered coatings; stoichiometry; strontium compounds; superconducting thin films; Bi loss; BiSrCaCuO; Cu loss; HTSC; O/sub 2/ partial pressure; RF magnetron sputtering variables; composition; deposition conditions; energetic particle bombardment; gas scattering effects; high pressure; low sputtering pressure; off-axis RF sputtered BiSrCaCuO thin films; off-axis geometry; resputtering problem; stoichiometry; substrate; substrate temperature; superconducting thin films; thermally enhanced resputtering; total sputtering pressure; Bismuth; Copper; Geometry; Particle scattering; Radio frequency; Sputtering; Substrates; Superconducting magnets; Superconducting thin films; Temperature;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.233372
Filename :
233372
Link To Document :
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