DocumentCode
940201
Title
A logic nanotechnology featuring strained-silicon
Author
Thompson, Scott E. ; Armstrong, Mark ; Auth, Chis ; Cea, Steve ; Chau, Robert ; Glass, Glenn ; Hoffman, Thomas ; Klaus, Jason ; Ma, Zhiyong ; Mcintyre, Brian ; Murthy, Anand ; Obradovic, Borna ; Shifren, Lucian ; Sivakumar, Sam ; Tyagi, Sunit ; Ghani, Tah
Author_Institution
Intel Corp., Hillsboro, OR, USA
Volume
25
Issue
4
fYear
2004
fDate
4/1/2004 12:00:00 AM
Firstpage
191
Lastpage
193
Abstract
Strained-silicon (Si) is incorporated into a leading edge 90-nm logic technology . Strained-Si increases saturated n-type and p-type metal-oxide-semiconductor field-effect transistors (MOSFETs) drive currents by 10 and 25%, respectively. The process flow consists of selective epitaxial Si1-xGex in the source/drain regions to create longitudinal uniaxial compressive strain in the p-type MOSFET. A tensile Si nitride-capping layer is used to introduce tensile uniaxial strain into the n-type MOSFET and enhance electron mobility. Unlike past strained-Si work: 1) the amount of strain for the n-type and p-type MOSFET can be controlled independently on the same wafer and 2) the hole mobility enhancement in this letter is present at large vertical electric fields, thus, making this flow useful for nanoscale transistors in advanced logic technologies.
Keywords
CMOS logic circuits; Ge-Si alloys; MOSFET; electron mobility; hole mobility; nanoelectronics; semiconductor epitaxial layers; silicon; 90 nm; CMOS logic; MOSFET drive currents; Si-SiGe; advanced logic technologies; electron mobility; hole mobility; logic nanotechnology; longitudinal uniaxial compressive strain; n-type MOSFET; nanoscale transistors; p-type MOSEFT; saturated n-type metal-oxide-semiconductor field-effect transistors; saturated p-type metal-oxide-semiconductor field-effect transistors; selective epitaxial Si1-xGex; source-drain regions; strained-silicon; tensile silicon nitride-capping layer; tensile uniaxial strain; vertical electric fields; Capacitive sensors; Electron mobility; FETs; Logic; MOSFETs; Nanotechnology; Silicon; Strain control; Transistors; Uniaxial strain;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2004.825195
Filename
1278552
Link To Document