Title :
Microstructural characterization of Ag-sheathed Tl-Ba-Ca-Cu-O and Bi-Sr-Ca-Cu-O superconducting tapes by analytical electron microscopy
Author :
Hu, J.G. ; Miller, D.J. ; Goretta, K.C. ; Poeppel, R.B.
Author_Institution :
Argonne Nat. Lab., IL, USA
fDate :
3/1/1993 12:00:00 AM
Abstract :
The microstructures of Tl(1223) and Pb-doped Bi(2223) silver tapes produced by the powder-in-tube (PIT) method have been examined by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and energy dispersive spectrometry (EDS). The Tl tapes annealed below the melting point exhibited fine grains and a high density of pores while tapes subjected to partial melting prior to solid state annealing were fully dense with large grains. However, these tapes also showed an increase in the size and density of impurity particles, particularly CaO and a Ba-Cu rich phase. Silver powders added to the precursors tended to promote the growth of Tl(1223) at lower temperatures but also interfered with the development of texture by providing nucleation sites of random orientations. In contrast, the Bi(2223) tape exhibited a high degree of texture and alignment. The incorporation of silver within the superconducting phase was found to be negligible for both the Tl(1223) and Bi(2223) tapes.<>
Keywords :
annealing; barium compounds; bismuth compounds; calcium compounds; grain size; high-temperature superconductors; lead compounds; scanning electron microscope examination of materials; silver; strontium compounds; texture; thallium compounds; transmission electron microscope examination of materials; BiPbSrCaCuO-Ag; EDS; SEM; TEM; TlBa/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/-Ag; fine grains; high temperature superconductors; impurity particles; large grains; microstructures; partial melting; solid state annealing; superconducting tapes; texture; Annealing; Dispersion; Impurities; Microstructure; Powders; Scanning electron microscopy; Silver; Solid state circuits; Spectroscopy; Transmission electron microscopy;
Journal_Title :
Applied Superconductivity, IEEE Transactions on