Title :
High-T/sub c/ SNS junctions for multilevel integrated circuits
Author :
Ono, R.H. ; Vale, L.R. ; Kimminau, K.R. ; Beall, J.A. ; Cromar, M.W. ; Reintsema, C.D. ; Harvey, T.E. ; Rosenthal, P.A. ; Rudman, D.A.
Author_Institution :
Nat. Inst. of Stand. & Technol., Boulder, CO, USA
fDate :
3/1/1993 12:00:00 AM
Abstract :
High-quality superconductor-normal metal-superconductor (SNS) Josephson microbridges have been fabricated in a variety of configurations across the edge of steps in a manner that is consistent with a multilevel integrated circuit process. The best junctions have critical current-resistance products of 1-3 mV at 4 K and 100-500 mu V at 77 K, useful values for many analog and digital applications not requiring hysteretic junctions. The DC transport characteristics of the junctions and issues of reproducibility and uniformity are discussed. In particular, a simple theoretically based analysis of junction parameter spread is presented.<>
Keywords :
Josephson effect; SQUIDs; atomic force microscopy; barium compounds; high-temperature superconductors; pulsed laser deposition; superconducting integrated circuits; superconducting thin films; yttrium compounds; 1 to 3 mV; 100 to 500 muV; 4 K; 77 K; AFM image; DC transport characteristics; SNS Josephson microbridges; SQUID; YBa/sub 2/Cu/sub 3/O/sub 7-x/ junction; critical current-resistance products; edge steps technique; high temperature superconductor; junction parameter spread; multilevel integrated circuit process; pulsed laser deposition; reproducibility; superconductor-normal metal-superconductor; Atomic force microscopy; Conductivity; Etching; Insulation; Niobium; Optical device fabrication; Pulsed laser deposition; Resists; Scanning electron microscopy; Substrates;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
