Title :
Analysis of the Effects of Tin Whiskers at High Frequencies
Author_Institution :
STMicroelectronics, Carrollton, TX
Abstract :
The initiative to remove lead from microelectronics packages has led to increased use of pure tin plating as the final finish on the leads of some parts. This finish can spontaneously grow whiskers on its surface. This paper presents results of a study by electromagnetic modeling into the possible effect of these whiskers on high-frequency signals. These results show that realistic configurations of whisker size and distribution will have only a very small effect on signal quality
Keywords :
electromagnetic wave propagation; electronics packaging; metallisation; tin; whiskers (crystal); electromagnetic modeling; high-frequency signals; microelectronics packages; signal quality; tin plating; tin whiskers; whisker distribution; whisker size; Crystallization; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Frequency; Integrated circuit packaging; Lead; Microelectronics; Surface finishing; Tin alloys; Electromagnetic; high frequency; signal integrity; tin whisker;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2006.887352
