DocumentCode
940835
Title
Analysis of the Effects of Tin Whiskers at High Frequencies
Author
Evans, Rich
Author_Institution
STMicroelectronics, Carrollton, TX
Volume
29
Issue
4
fYear
2006
Firstpage
274
Lastpage
279
Abstract
The initiative to remove lead from microelectronics packages has led to increased use of pure tin plating as the final finish on the leads of some parts. This finish can spontaneously grow whiskers on its surface. This paper presents results of a study by electromagnetic modeling into the possible effect of these whiskers on high-frequency signals. These results show that realistic configurations of whisker size and distribution will have only a very small effect on signal quality
Keywords
electromagnetic wave propagation; electronics packaging; metallisation; tin; whiskers (crystal); electromagnetic modeling; high-frequency signals; microelectronics packages; signal quality; tin plating; tin whiskers; whisker distribution; whisker size; Crystallization; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Frequency; Integrated circuit packaging; Lead; Microelectronics; Surface finishing; Tin alloys; Electromagnetic; high frequency; signal integrity; tin whisker;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2006.887352
Filename
4052449
Link To Document