Title :
Plastic separation planning for end-of-life electronics
Author :
Williams, Julie Ann Stuart ; Grant, Edward R. ; Rios, Pedro ; Blyler, Leslie ; Tieman, Lisa ; Twining, Leslie ; Bonawi-Tan, Winston ; Madden, Michelle ; Guthrie, Natalie R Meyer
Author_Institution :
Dept. of Manage. & Manage. Inf. Syst., Univ. of West Florida, Pensacola, FL, USA
fDate :
4/1/2006 12:00:00 AM
Abstract :
Important challenges remain for sustainable design, manufacture, use, and recycling of electronics including materials selection and disassembly time. This paper examines the value relationship between the quantity of plastics separated and the time required for disassembly and segregation. Labor costs for disassembly can constitute a large portion of the total acquisition cost for a recycled material. We report work measurement studies conducted on the disassembly of 21 computers, 22 printers, and 32 monitors manufactured by 27 producers in the years from 1984 to 2001. Results include the weight per total separation time for each plastic part. Each recovered part is identified according to polymer resin using laser Raman spectroscopy by chemometric reference to a library of standards. We extrapolate time as well as the product input required to accumulate various specific types of plastic. We develop disassembly policies and show that they are effective for a variety of computer, printer, or monitor models, which is typical of the random product streams that arrive at electronics recycling facilities. The results demonstrate how new laser identification technology and work measurement can be used for plastics separation planning.
Keywords :
Raman spectroscopy; consumer electronics; design for disassembly; plastics; process planning; recycling; chemometric reference; disassembly time; electronics recycling facility; end-of-life electronics; laser Raman spectroscopy; laser identification technology; materials selection; plastic separation planning; polymer resin; random product streams; Computer aided manufacturing; Computer displays; Conducting materials; Costs; Laser modes; Plastics; Polymers; Printers; Recycling; Resins; Disassembly; Raman spectroscopy; electronics recycling; plastics; work measurement;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2006.874968