DocumentCode
941504
Title
A Thermal Conductivity Model for Micro-Nanoscale Diamond Thin Films Using Dispersion Curve Data
Author
Kalisik, Todd ; Majumdar, Pradip
Author_Institution
Northern Illinois Univ., DeKalb
Volume
30
Issue
4
fYear
2007
Firstpage
683
Lastpage
690
Abstract
Thermal conductivity is investigated for a cubic C (diamond). Boundary scattering, Umklapp processes, normal processes, and the presence of impurities are the mechanisms considered for heat flow resistance. Three symmetry directions [001], [110], [111], and three polarizations for each direction in the first Brillouin zone are considered for the material. The main purpose of this study is to analyze the effect of the curvature of phonon dispersion curves on the thermal conductivity, and develop an accurate model. The model incorporates the effects of impurity and impurity concentration, film thickness, and crystal orientation on thermal conductivity. The model is validated by comparing results with experimental data for diamond in the [111] direction. The model is then used for the other symmetry directions using the appropriate dispersion curves. The results show that the curvature of the dispersion curves dramatically affects the thermal conductivity. A sensitivity analysis is conducted to study the effect of boundary scattering as the film decreases in thickness and the effect of impurities.
Keywords
Brillouin zones; diamond; impurity distribution; nanostructured materials; phonon dispersion relations; thermal conductivity; thin films; umklapp process; Brillouin zone; C; Umklapp processes; [001] symmetry; [110] symmetry; [111] symmetry; boundary scattering; crystal orientation; cubic diamond; heat flow resistance; impurity concentration; microscale diamond thin film; nanoscale diamond thin film; phonon dispersion curve curvature; polarization; sensitivity analysis; thermal conductivity model; Diamond; micro-nanoscale; thermal conductivity;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.900077
Filename
4358335
Link To Document