DocumentCode :
942125
Title :
Testing Network-on-Chip Communication Fabrics
Author :
Grecu, Cristian ; Ivanov, André ; Saleh, Resve ; Pande, Partha P.
Author_Institution :
Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
Volume :
26
Issue :
12
fYear :
2007
Firstpage :
2201
Lastpage :
2214
Abstract :
Network-on-chip (NoC) communication fabrics will be increasingly used in many large multicore system-on-chip designs in the near future. A relevant challenge that arises from this trend is that the test costs associated with NoC infrastructures may account for a significant part of the total test budget. In this paper, we present a novel methodology for testing such NoC architectures. The proposed methodology offers a tradeoff between test time and on-chip self-test resources. The fault models used are specific to deep submicrometer technologies and account for crosstalk effects due to interwire coupling. The novelty of our approach lies in the progressive reuse of the NoC infrastructure to transport test data to the components under test in a recursive manner. It exploits the inherent parallelism of the data transport mechanism to reduce the test time and, implicitly, the test cost. We also describe a suitable test-scheduling approach. In this manner, the test methodology developed in this paper is able to reduce the test time significantly as compared to previously proposed solutions, offering speedup factors ranging from 2x to 34x for the NoCs considered for experimental evaluation.
Keywords :
crosstalk; integrated circuit modelling; integrated circuit testing; network-on-chip; NoC infrastructures; communication fabrics; crosstalk effects; data transport; fault models; integrated circuit testing; interwire coupling; multicore system-on-chip; network on chip; test scheduling; Interconnect infrastructure; interconnect infrastructure; multicast test; network-on-chip; network-on-chip (NoC); test optimization; unicast test;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2007.907263
Filename :
4358506
Link To Document :
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