Title :
Low thermal resistance high-speed top-emitting 980-nm VCSELs
Author :
Al-Omari, A.N. ; Carey, G.P. ; Hallstein, S. ; Watson, J.P. ; Dang, G. ; Lear, K.L.
Author_Institution :
Electr. & Comput. Eng. Dept., Colorado State Univ., Fort Collins, CO
fDate :
6/1/2006 12:00:00 AM
Abstract :
Increasing copper plated heatsink radii from 0 to 4 mum greater than the mesa in vertical-cavity surface-emitting lasers (VCSELs) reduced the measured thermal resistance for a range of device sizes to values 50% lower than previously reported over a range of device sizes. For a 9-mum diameter oxide aperture, the larger heatsink increases output power and bandwidth by 131% and 40%, respectively. The lasers exhibit a 3-dB modulation frequency bandwidth up to 9.8 GHz at 10.5 kA/cm2. The functional dependence of thermal resistance on oxide aperture diameter indicates the importance of lateral heat flow to mesa sidewalls
Keywords :
copper; frequency modulation; semiconductor device measurement; semiconductor lasers; surface emitting lasers; thermal resistance; 9 mum; Cu; copper plated heatsink; lateral heat flow; modulation frequency bandwidth; oxide aperture; thermal resistance; top-emitting VCSEL; vertical-cavity surface-emitting laser; Apertures; Bandwidth; Copper; Electrical resistance measurement; Resistance heating; Size measurement; Surface emitting lasers; Surface resistance; Thermal resistance; Vertical cavity surface emitting lasers; 3-dB frequency; heatsinks; modulation bandwidth; semiconductor laser diodes; thermal management; vertical-cavity surface-emitting laser (VCSEL);
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2006.875059