Title :
Differential Temperature Sensors Fully Compatible With a 0.35-
m CMOS Process
Author :
Aldrete-Vidrio, Eduardo ; Mateo, Diego ; Altet, Josep
Author_Institution :
Univ. Politecnica de Catalunya, Barcelona
Abstract :
Four differential temperature sensors, two passive and two active, designed and fabricated in a 0.35-m standard CMOS technology, are presented and characterized. Passive sensors are based on integrated thermopiles. Each one consists of eight thermocouples (16 strips) serially connected: poly1-poly2 for the first thermopile and poly1-P+diffusion for the second one. The active sensors are based on differential amplifiers, one with single-ended output and the other with differential output. Lateral parasitic bipolar transistors are used as temperature transducer devices. Both simulated and experimental characterizations are presented. The high sensitivity of active differential temperature sensors proves the feasibility of such sensors to observe the power dissipated by devices and circuits embedded in the same silicon die, with applications to the test and characterization of circuits, packaging characterization and compensation of thermal gradients, among others.
Keywords :
CMOS integrated circuits; bipolar transistors; differential amplifiers; differential thermal analysis; integrated circuit packaging; temperature measurement; temperature sensors; thermal management (packaging); thermocouples; thermopiles; CMOS process; active sensors; circuit testing; circuits characterization; differential amplifiers; differential temperature sensors; integrated thermopiles; lateral parasitic bipolar transistors; packaging characterization; passive sensors; power dissipation; serial connected thermocouples; silicon die; size 0.35 mum; temperature measurements; temperature transducer devices; thermal gradients compensation; thermal testing; CMOS technology; differential temperature sensors; lateral parasitic bipolar transistor; temperature measurements; thermal testing; thermocouples; thermopiles;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.906349