• DocumentCode
    942413
  • Title

    SQUID systems for non-destructive testing by AC field mapping

  • Author

    Cochran, A. ; Morgan, L.N.C. ; Bowman, R.M. ; Kirk, K.J. ; Donaldson, G.B.

  • Author_Institution
    Dept. of Phys. & Appl. Phys., Strathclyde Univ., Glasgow, UK
  • Volume
    3
  • Issue
    1
  • fYear
    1993
  • fDate
    3/1/1993 12:00:00 AM
  • Firstpage
    1926
  • Lastpage
    1929
  • Abstract
    The authors describe a low-temperature liquid-helium superconducting quantum interference device (SQUID) system with high spatial resolution and a wider bandwidth than usual for an all-metal cryostat and which also provides access for a mechanism to balance the pick-up coils. They discuss the effects of these properties on AC field measurement and present experimental results from small slits which mimic growing fatigue cracks. Related work on high-temperature superconducting devices indicates that they will offer important advantages over low-temperature SQUIDs, particularly in terms of cryogenic design which has been so restrictive in low-temperature systems. The authors suggest that even relatively poor high-temperature-superconductor SQUID performance will be acceptable if these advantages can be exploited.<>
  • Keywords
    SQUIDs; crack detection; field plotting; flaw detection; magnetic field measurement; magnetometers; AC field mapping; NDT; SQUID systems; bandwidth; cryogenic design; flaw detection; growing fatigue cracks; high-temperature superconducting devices; low-temperature SQUIDs; low-temperature liquid-helium superconducting quantum interference device; magnetic field maps; nondestructive testing; pick-up coils; small slits; spatial resolution; Bandwidth; Fatigue; High temperature superconductors; Interference; Nondestructive testing; SQUIDs; Spatial resolution; Superconducting coils; Superconducting devices; System testing;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.233584
  • Filename
    233584