The changing technology of electronic components and assemblies

Demands made upon the electronics industry and the fierce competition for both components and equipment here and abroad are leading to major changes in both component technology and interconnect. This review of these trends highlights the impact each is now having on the other and demonstrates how the electronics industry is responding to the need for improved design automation and factory mechanisation. Technology and manufacturing processes have changed from the early thermionic valve devices to the present day complex silicon components, and new technologies enable surface mounting of electronic components to be reliably and economically achieved. The complete assembly of surface-mounted components, the advantages, problems and mechanisation possibilities for such an approach are discussed. The reliability and overall cost aspects of today´s systems are presented, together with predictions of possible future trends. The electronics industry continually strives to reduce size and weight of both components and equipment, together with cost, reliability and function density.