• DocumentCode
    942944
  • Title

    A universal de-embedding procedure for the "on-wafer" GHz probing

  • Author

    Weng, J.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
  • Volume
    42
  • Issue
    9
  • fYear
    1995
  • fDate
    9/1/1995 12:00:00 AM
  • Firstpage
    1703
  • Lastpage
    1705
  • Abstract
    A novel de-embedding procedure for "on-wafer" GHz probing is presented. The parasitic effects arising from the bond-pads are modeled generally by two-port networks. Thus, no equivalent circuit details are required. Even the transmission line effects occurring at extremely high frequencies can be taken into account in this model.
  • Keywords
    MIMIC; MMIC; S-parameters; crosstalk; integrated circuit testing; microwave measurement; millimetre wave measurement; two-port networks; bond-pads; onwafer GHz probing; parasitic effects modelling; transmission line effects; two-port networks; universal de-embedding procedure; Bonding; Contacts; Crosstalk; Distributed parameter circuits; Equivalent circuits; Error correction; Feeds; Frequency; Propagation losses; Transmission line matrix methods;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.405290
  • Filename
    405290
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=942944