• DocumentCode
    943020
  • Title

    Dynamic measurement of flux flow resistivity in YBa/sub 2/Cu/sub 3/O/sub 7/ wires

  • Author

    Askew, T.R. ; Nestell, J.G. ; Flippen, R.B. ; Groski, D.M. ; Alford, N.McN.

  • Author_Institution
    Kalamazoo Coll., MI, USA
  • Volume
    3
  • Issue
    1
  • fYear
    1993
  • fDate
    3/1/1993 12:00:00 AM
  • Firstpage
    1398
  • Lastpage
    1401
  • Abstract
    Polycrystalline samples of YBa/sub 2/Cu/sub 3/O/sub 7/ have been pushed deep into the flux flow regime using submillisecond feedback-controlled current ramps. Thermal stability has been maintained in the 65-93 K range in spite of current densities that exceed J/sub c/ by a factor of four or more. Linear I-V relations are observed, and the measured flux flow resistivity shows a simple dependence on the microstructure of the samples. The resistivity of unoriented ceramic samples shows essentially no dependence on magnetic field between 0.05 T and 0.5 T, and shows a slight dependence on temperature that mirrors the linear behavior of the normal state resistivity down to about 72 K. Below 72 K the flux flow resistivity begins to rise with dropping temperature. In contrast, directionally solidified samples show a much lower flux flow resistivity with almost no temperature dependence. A strong field dependence appears in this latter case, one that is reminiscent of the Bardeen-Stephen flux flow resistivity of low T/sub c/ materials.<>
  • Keywords
    barium compounds; flux flow; high-temperature superconductors; yttrium compounds; 65 to 93 K; YBa/sub 2/Cu/sub 3/O/sub 7/ wires; directionally solidified samples; dynamic measurement; flux flow resistivity; high temperature superconductor; linear I-V relations; microstructure; normal state resistivity; submillisecond feedback-controlled current ramps; temperature dependence; thermal stability; unoriented ceramic samples; Ceramics; Conductivity; Current density; Fluid flow measurement; Magnetic field measurement; Microstructure; Mirrors; Temperature dependence; Thermal factors; Thermal stability;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.233637
  • Filename
    233637