DocumentCode :
943043
Title :
Inclusion of conductivity in silicon s.a.w. component design
Author :
Venema, A. ; Humphryes, R.F.
Author_Institution :
Delft University of Technology, Department of Electrical Engineering Laboratory for Electrical Materials, Delft, Netherlands
Volume :
13
Issue :
20
fYear :
1977
Firstpage :
594
Lastpage :
596
Abstract :
An equivalent circuit is described for a surface-acoustic-wave delay line utilising interdigital transducers in a multilayered medium with a conductive silicon substrate. Attention is paid to practical material parameters for the ultimate realisation of the monolithic integration of surface-acoustic-wave and electronic components on the same silicon slice.
Keywords :
acoustic surface wave devices; equivalent circuits; ultrasonic delay lines; Si SAW component design; conductivity; equivalent circuit; interdigital transducers; monolithic integration; multilayered medium; surface acoustic wave delay line;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19770428
Filename :
4240569
Link To Document :
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