DocumentCode
943313
Title
Mechanism of Increase in SRAM
Due to Negative-Bias Temperature Instability
Author
Carlson, Andrew
Author_Institution
Univ. of California at Berkeley, Berkeley
Volume
7
Issue
3
fYear
2007
Firstpage
473
Lastpage
478
Abstract
Negative-bias temperature instability (NBTI) has been identified as a problem for static random-access-memory (SRAM) reliability since variations in the PMOS threshold voltages have been shown to correlate with rising Vmin over time. The effect is greater than what would be expected from the relatively low sensitivity of the static-noise margin to PMOS device parameters reported in the literature. This paper investigates the mechanism of Vmin increases due to NBTI. It is shown that the sensitivity to PMOS threshold voltages increases at low voltages, and furthermore, this sensitivity can be exacerbated by process variations in other SRAM devices. For the design of an array with many cells, the most probable combination of parameter variations to set a given Vmin is identified and shown to change to a more probable combination with NBTI. Statistical designs must therefore consider NBTI as an additional source of variation, with increasing significance at low voltages.
Keywords
MOS integrated circuits; SRAM chips; NBTI; PMOS device parameter; SRAM reliability; negative-bias temperature instability; static random-access-memory; static-noise margin; $V_{min}$ ; Memories; NBTI; Reliability; SRAM; Vmin; negative-bias temperature instability (NBTI); reliability; static random-access memory (SRAM);
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2007.907409
Filename
4358691
Link To Document