• DocumentCode
    945185
  • Title

    High-temperature superconducting current leads

  • Author

    Hull, J.R.

  • Author_Institution
    Argonne Nat. Lab., IL, USA
  • Volume
    3
  • Issue
    1
  • fYear
    1993
  • fDate
    3/1/1993 12:00:00 AM
  • Firstpage
    869
  • Lastpage
    875
  • Abstract
    The author reviews major high-temperature superconductor (NTS) current-lead concepts and presents several new considerations that should affect design of HTS leads. Considerable advantage is achieved by operating these leads with an intermediate-temperature heat sink. The HTS part of the lead can be made from pressed and sintered powder. Powder-in-tube fabrication is also possible, but the normal metal part of the lead acts as a thermal short and cannot provide much stabilization without increasing the refrigeration requirement. For lead stability, designs with low current density are favored. Such leads can be manufactured with today´s technology, and refrigeration requirements are lower for the same allowable burnout time. Higher current densities result in lower helium boil-off for the same lead length, but burnout times can be very short. In comparing experiment to theory in open systems, the density of helium vapor must be accounted for in calculating the expected boil-off. For very-low-loss leads, two-dimensional heat transfer and the state of the dewar near the leads may play dominant roles in lead performance.<>
  • Keywords
    high-temperature superconductors; sintering; superconducting cables; boil-off; high-temperature superconductor; intermediate-temperature heat sink; lead stability; powder in tube fabrication; pressed powder; refrigeration requirements; sintered powder; superconducting current leads; two-dimensional heat transfer; very-low-loss leads; Current density; Fabrication; Heat sinks; High temperature superconductors; Manufacturing; Open systems; Powders; Refrigeration; Stability;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.233839
  • Filename
    233839