Title :
European project for the development of high T/sub C/ current leads
Author :
Herrmann, P.F. ; Albrecht, C. ; Bock, J. ; Cottevieille, C. ; Elschner, Steffen ; Herkert, W. ; Lafon, M.-O. ; Lauvray, H. ; Leriche, A. ; Nick, W. ; Preisler, E. ; Salzburger, H. ; Tourre, J.-M. ; Verhaege, T.
Author_Institution :
Alcatel Alsthom Recherche, Marcoussis, France
fDate :
3/1/1993 12:00:00 AM
Abstract :
A European BRITE/EURAM project for the development of current leads in the kA range using high-T/sub C/ superconductor parts has been started recently. The partners in this two-year project are two chemical companies, Hoechst and Rhone-Poulenc, and two companies in the field of electrical engineering, Siemens and Alcatel Alsthom. The goal of these four companies is to develop current leads for 4.2-K systems making use of high-T/sub C/ superconducting materials, to manufacture them, to demonstrate their performance in comparison with conventional all-metal current lead, and to develop relevant models. The objective is the realization of a demonstration current lead toward the end of the project. This device will operate at a steady-state current of 1000 A and an insulation voltage of 20 kV. The losses will be reduced to one-third of the losses of a conventional metallic current lead. First results are given on Y- and Bi-based current lead models, including calculations and the characterization of large bulk high-T/sub C/ samples up to a length of 200 mm with a I/sub C/ value reaching 2000 A.<>
Keywords :
high-temperature superconductors; losses; superconducting cables; 1000 A; 20 kV; 200 mm; 2000 A; 4.2 K; European BRITE/EURAM project; bulk high-T/sub C/ samples; high temperature superconductor; high-T/sub C/ superconductor; losses; steady-state current; Ceramics; Chemical engineering; Conducting materials; Electrical engineering; High temperature superconductors; Integrated circuit modeling; Power generation economics; Steady-state; Superconducting materials; Thermal conductivity;
Journal_Title :
Applied Superconductivity, IEEE Transactions on