Title :
Low-Noise HEMT Using MOCVD
Author :
Tanaka, Kuninobu ; Ogawa, Masamichi ; Togashi, Kou ; Takakuwa, Hidemi ; Ohke, Hajime ; Kanazawa, Masayoshi ; Kato, Yoji ; Watanabe, Seiichi
fDate :
12/1/1986 12:00:00 AM
Abstract :
Low-noise HEMT AIGaAs/GaAs heterostructure devices have been developed using metal organic chemical vapor deposition (MOCVD). The HEMT´s with 0.5-µm-long and 200-µm-wide gates have shown a minimum noise figure of 0.83 dB with an associated gain of 12.5 dB at 12 GHz at room temperature. Measurements have confirmed calculations on the effect of the number of gate bonding pads on the noise figure for different gate widths. Substantial noise figure improvement was observed under low-temperature operation, especially compared to conventional GaAs MESFET´s. A two-stage amplifier designed for DBS reception using the HEMT in the first stage has displayed a noise figure under 2.0 dB from 11.7 to 12.2 GHz.
Keywords :
Bonding; Chemical vapor deposition; Gain; Gallium arsenide; HEMTs; MOCVD; Noise figure; Noise measurement; Organic chemicals; Temperature measurement;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.1986.1133573