Title :
Evaluation of Cu:SC ratio measurements by chemical etching, electrical resistivity, and image analysis
Author :
Pyon, T. ; Warnes, W.H. ; Siddall, M.
Author_Institution :
Dept. of Mech. Eng., Oregon State Univ., Corvallis, OR, USA
fDate :
3/1/1993 12:00:00 AM
Abstract :
A comparison is made of the techniques for measuring the copper to superconductor ratio (Cu:SC) in a set of commercial laboratory composite superconducting wires produced for the Superconducting Super Collider (SSC). The simplest and most straightforward technique, chemical etching, was found to display the best reproducibility. The electrical resistivity technique shows the most variation and sensitivity to measurement errors, as well as being the most difficult to perform. The image analysis technique is fast and fairly reproducible.<>
Keywords :
composite superconductors; copper; electrical conductivity of crystalline metals and alloys; etching; metallography; niobium alloys; stoichiometry; titanium alloys; Cu; Cu-NbTi; Cu:SC ratio; NbTi; chemical etching; composite superconducting wires; copper to superconductor ratio; electrical resistivity; image analysis; measurement errors; metallographic imaging; sensitivity; Chemicals; Copper; Displays; Electric resistance; Etching; Laboratories; Measurement errors; Performance evaluation; Reproducibility of results; Superconducting filaments and wires;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
