Evaluation of Cu:SC ratio measurements by chemical etching, electrical resistivity, and image analysis

Author

Pyon, T. ; Warnes, W.H. ; Siddall, M.

Author_Institution

Dept. of Mech. Eng., Oregon State Univ., Corvallis, OR, USA

Volume

3

Issue

1

fYear

1993

fDate

3/1/1993 12:00:00 AM

Firstpage

1018

Lastpage

1021

Abstract

A comparison is made of the techniques for measuring the copper to superconductor ratio (Cu:SC) in a set of commercial laboratory composite superconducting wires produced for the Superconducting Super Collider (SSC). The simplest and most straightforward technique, chemical etching, was found to display the best reproducibility. The electrical resistivity technique shows the most variation and sensitivity to measurement errors, as well as being the most difficult to perform. The image analysis technique is fast and fairly reproducible.<>

Keywords

composite superconductors; copper; electrical conductivity of crystalline metals and alloys; etching; metallography; niobium alloys; stoichiometry; titanium alloys; Cu; Cu-NbTi; Cu:SC ratio; NbTi; chemical etching; composite superconducting wires; copper to superconductor ratio; electrical resistivity; image analysis; measurement errors; metallographic imaging; sensitivity; Chemicals; Copper; Displays; Electric resistance; Etching; Laboratories; Measurement errors; Performance evaluation; Reproducibility of results; Superconducting filaments and wires;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.233871

Filename

233871