Delamination problems of UV-cured adhesive bonded optical fiber in V-groove for photonic packaging

Author

Uddin, M.A. ; Chan, H.P. ; Lam, K.W. ; Chan, Y.C. ; Chu, P.L. ; Hung, K.C. ; Tsun, T.O.

Author_Institution

Dept. of Electron. Eng., City Univ. of Hong Kong, China

Volume

16

Issue

4

fYear

2004

fDate

4/1/2004 12:00:00 AM

Firstpage

1113

Lastpage

1115

Abstract

In this letter, we investigated the origin of the interfacial delamination due to uneven curing of ultraviolet (UV) adhesive in the fixing process of a fiber on a V-groove. The analytical ray tracing technique is used to estimate the UV intensity at different locations along the adhesive-fiber interface. Consequently, the unexposed or shaded region in the adhesive layer is determined, through which the interfacial delamination as a result of the reliability test is predicted.

Keywords

adhesive bonding; adhesives; curing; delamination; interface phenomena; optical fabrication; optical fibre testing; packaging; ray tracing; reliability; ultraviolet radiation effects; UV intensity; UV-cured adhesive bonded optical fiber; V-groove; adhesive layer; adhesive-fiber interface; analytical ray tracing technique; delamination problems; fixing process; interfacial delamination; photonic packaging; reliability test; ultraviolet adhesive; uneven curing; Assembly; Bonding; Curing; Delamination; Optical devices; Optical fiber devices; Optical fiber testing; Optical fibers; Packaging; Telecommunication network reliability;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2004.824639

Filename

1281888