DocumentCode :
945943
Title :
Thermal regulator for IC temperature characterization using a microprobe station
Author :
Baderna, Davide ; Cabrini, Alessandro ; Torelli, Guido
Author_Institution :
Dept. of Electron., Univ. of Pavia
Volume :
55
Issue :
3
fYear :
2006
fDate :
6/1/2006 12:00:00 AM
Firstpage :
754
Lastpage :
760
Abstract :
This paper presents a thermal regulator conceived to allow the electrical characterization of integrated circuits (ICs) over a wide temperature range. The main feature, as compared to conventional thermal chambers, is the possibility to reach test points on the IC surface by means of a microprobe station. The thermal regulator is based on a Peltier cell, which is placed close to the bottom side of the device under test (DUT). This way, the cooling/heating power needed to reach the required IC temperature, is supplied directly through the thermal conduction of the package and the chip substrate. The main advantages of the proposed solution are low cost, small size, accurate temperature control, and fast settling time. The measured temperature range is from -40degC up to +120degC with a settling time of about 4 min. The maximum power consumption is about 30 W (during startup transients)
Keywords :
Peltier effect; cooling; heat conduction; heating; integrated circuit packaging; integrated circuit testing; temperature control; thermal management (packaging); -40 to 120 C; DUT; IC temperature characterization; Peltier cell; chip substrate; device under test; integrated circuits; microprobe station; temperature control; thermal chambers; thermal conduction; thermal regulator; Circuit testing; Cooling; Costs; Heating; Integrated circuit packaging; Integrated circuit testing; Regulators; Temperature distribution; Temperature measurement; Thermal conductivity; Electrical cooling; Peltier cell; probe station; thermal IC characterization; thermal regulator;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.2006.870102
Filename :
1634864
Link To Document :
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