• DocumentCode
    946364
  • Title

    Fabrication and measurement of submicron planar YBa/sub 2/Cu/sub 3/O/sub 7/ microbridge Josephson junctions

  • Author

    Bao, Z. ; Ji, L. ; Lin, K.Y. ; Bi, B. ; Han, S. ; Lukens, J.E.

  • Author_Institution
    Dept. of Phys., State Univ. of New York, Stony Brook, NY, USA
  • Volume
    3
  • Issue
    1
  • fYear
    1993
  • fDate
    3/1/1993 12:00:00 AM
  • Firstpage
    2417
  • Lastpage
    2420
  • Abstract
    Deep-submicron planar YBa/sub 2/Cu/sub 3/O/sub 7/ (YBCO) microbridge Josephson junctions (about 0.1- mu m to 0.5- mu m long and wide) were fabricated using two different approaches: (1) using electron beam lithography and argon-ion milling to make the designed bridge pattern; and (2) depositing YBCO on a substrate with a prepatterned MgO/sapphire bilayer structure. Both approaches have yielded microbridges showing constant voltage steps in the current-voltage characteristics under applied microwave fields. The step width is also found to show oscillatory microwave power dependence. The possible mechanism for the Josephson-like behavior observed and the physical significance of these deep submicron bridges are discussed. The observed phenomena might be explained by the vortex motion model.<>
  • Keywords
    Josephson effect; barium compounds; electron beam lithography; high-temperature superconductors; superconducting junction devices; yttrium compounds; Ar ion milling; MgO-Al/sub 2/O/sub 3/ substrate; YBa/sub 2/Cu/sub 3/O/sub 7/-MgO-Al/sub 2/O/sub 3/; applied microwave fields; constant voltage steps; current-voltage characteristics; deep submicron planar type; electron beam lithography; microbridge Josephson junctions; oscillatory microwave power dependence; prepatterned MgO/sapphire bilayer structure; vortex motion model; Bridge circuits; Electron beams; Fabrication; Josephson junctions; Lithography; Milling; Optical films; Substrates; Superconductivity; Yttrium barium copper oxide;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.233943
  • Filename
    233943