DocumentCode :
947820
Title :
A comparison of In0.5Ga0.5P/GaAs:C single and double-heterojunction bipolar transistors grown by LP-MOCVD
Author :
Hanson, A.W. ; Stockman, S.A. ; Stillman, G.E.
Author_Institution :
Center for Compound Semicond. Microelectron., Urbana, IL
Volume :
39
Issue :
11
fYear :
1992
fDate :
11/1/1992 12:00:00 AM
Firstpage :
2656
Lastpage :
2657
Abstract :
Summary form only given. The authors present a comparison of single- and double-heterojunction devices formed in the InGaP/GaAs materials system. The HBT (heterojunction bipolar transistor) structures used for this study were grown by LP-MOCVD (low-pressure metal-organic chemical vapor deposition) using CCl4 as the base dopant. It was found that the use of a 25-Å spacer layer provided the highest gains in these device structures, with βMAX~210. A decrease in current gain with increasing spacer layer thickness was attributed to space-charge recombination current at the emitter-base junction. Despite the small conduction band discontinuity reported for this materials system, the gains for the double-heterojunction transistors were considerably lower (βMAX~25) than for single-heterojunction devices for which all other layers besides the collector were identical. BVCEO and BVCBO are, however, significantly higher for InGaP collector structures (22 and 25 V as compared with 9.5 and 18 V for a GaAs collector, respectively)
Keywords :
III-V semiconductors; carbon; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; semiconductor growth; vapour phase epitaxial growth; HBT; In0.5Ga0.5P-GaAs:C; LP-MOCVD; base dopant; conduction band discontinuity; current gain; double-heterojunction bipolar transistors; emitter-base junction; low-pressure metal-organic chemical vapor deposition; single-heterojunction devices; space-charge recombination current; spacer layer; tetrachloromethane; Acceleration; Bipolar transistors; Chemical technology; Etching; Gallium arsenide; Heterojunction bipolar transistors; MOCVD; Surface resistance; Voltage; Zinc;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.163517
Filename :
163517
Link To Document :
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