DocumentCode
948200
Title
Silicon carbide microwave MESFET´s
Author
Clarke, R.C. ; Smith, T.J. ; Sriram, Srinath ; Barrett, D.L.
Author_Institution
Westinghouse Sci. & Technol. Center, Pittsburgh, PA
Volume
39
Issue
11
fYear
1992
fDate
11/1/1992 12:00:00 AM
Firstpage
2666
Abstract
Summary form only given. The authors describe record-setting 5-GHz SiC MESFET performance and the effects of device design on achieving these results. Bulk growth of 6H-SiC was performed using a physical vapor transport process, and the resultant undoped single-crystal boules were sliced and polished to generate 1-in-diameter wafers. These wafers were then used as substrates for the chemical vapor deposition of doped silicon carbide active layers. Wafers contained 24 chips, each consisting of an array of MESFETs having systematically varied geometry. A sample DC characteristic from a 320-μm periphery MESFET showed a knee voltage of 8 V, a transconductance of 20 mS/mm, a maximum channel current of 210 mA/mm, and a gate-to-drain breakdown voltage of 100 V. Automated RF probing was used to obtain wafer maps of small signal gain, F T, and F max, revealing an excellent transistor yield of 87%. The highest-gain MESFETs in the array developed 12 dB of gain at 2 GHz with a cutoff frequency of 5 GHz
Keywords
Schottky gate field effect transistors; chemical vapour deposition; semiconductor materials; silicon compounds; solid-state microwave devices; 100 V; 12 dB; 2 to 5 GHz; 20 mS; DC characteristic; MESFET performance; SiC; breakdown voltage; chemical vapor deposition; device array; doped active layer; microwave transistors; physical vapor transport process; undoped single-crystal boules; Breakdown voltage; Chemical vapor deposition; Geometry; Knee; MESFETs; Microwave devices; RF signals; Radio frequency; Silicon carbide; Transconductance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.163535
Filename
163535
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