Title :
A charge-control SPICE engineering model for the parasitic bipolar transistor action in SOI CMOS single-event upsets
Author :
Fulkerson, David E. ; Liu, Harry
Author_Institution :
Honeywell Defense & Space Electron. Syst., Plymouth, MN, USA
Abstract :
An ion strike on an SOI CMOS transistor produces a charge cloud of electron-hole pairs. The subsequent behavior of the charge cloud as it spreads and impinges on the source and drain junctions is explained by 1-D analytical solutions and by 2-D device simulations. By examining the charge cloud from a "top view" perspective and a "side view" perspective, it is shown that a 2-D "side view" simulation gives about the same electrical behavior as would a 3-D simulation, thereby eliminating the necessity for expensive and time-consuming 3-D simulations. It is further shown that the electrical behavior predicted by 2-D simulations can be captured in a simple bipolar SPICE model, which is necessary for practical SEU analysis of large numbers of logic and memory cell types. The SPICE model is based on fundamental physical parameters, not curve-fitting. The predictions of the SPICE model correlate well with experimental SEU sensitivities of a D-type flip-flop and a six-transistor SRAM cell processed in a 0.35 μm SOI technology.
Keywords :
CMOS integrated circuits; SPICE; SRAM chips; bipolar transistors; diffusion; flip-flops; integrated circuit modelling; ion beam effects; silicon-on-insulator; 1-D analytical solution; 2-D device simulation; 3-D simulation; D-type flip-flop; Medici simulation; SEU analysis; SOI CMOS single-event upsets; SOI CMOS transistor; charge cloud; charge-control SPICE engineering model; curve-fitting analysis; diffusion; drain junction; electrical behavior; electron-hole pair production; fundamental physical parameter; ion strike effect; logic cell; memory cell; parasitic bipolar transistor action; six-transistor SRAM cell; source junction; Analytical models; Bipolar transistors; Clouds; Curve fitting; Flip-flops; Logic; Predictive models; SPICE; Semiconductor device modeling; Single event upset;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2004.825105