Packaging of Transistorized Assemblies

This paper discusses the basic concept of utilizing functional circuits and packaging them into modular end products. As the modular philosophy has advanced, the size of the modular assembly itself has decreased. Several different modes of encapsulation are discussed. Encapsulation by casting is presented. Trimming operations on the cast module are discussed. Encapsulation by pressure molding is compared to casting methods. It is shown that many of the disadvantages of the individual methods can be eliminated by the combination of these two encapsulation methods.