Lithographyless ion implantation technology for agile fab

Author

Nishihashi, Tsutomu ; Kashimoto, Kazuhiro ; Fujiyama, Junki ; Sakurada, Yuzo ; Shibata, Takeshi ; Suguro, Kyoichi ; Sugihara, Kazuyoshi ; Okumura, Katsuya ; Gotou, Tadashi ; Saji, Nobuhito ; Tsunoda, Michio

Author_Institution

ULVAC Inc., Shizuoka, Japan

Volume

15

Issue

4

fYear

2002

fDate

11/1/2002 12:00:00 AM

Firstpage

464

Lastpage

469

Abstract

A new type of ion implanter developed for an agile fab can eliminate the processes concerned. with photoresist lithography from the ion implantation process. This new ion implantation technology can reduce the raw process time, footprint, and the cost of ownership to less than one-half that of conventional ion implantation technology. The authors are making further developments on this ion implanter and evaluating technical issues related to ion implantation. This technique is suitable for manufacturing submicron node IC devices. Based on the results of evaluating the prototype machine, we will produce the next β-machine.

Keywords

VLSI; ion implantation; masks; β-machine; agile fab; cost of ownership; footprint; ion implantation process; lithographyless ion implantation technology; raw process time; stencil; submicron node IC devices; Agile manufacturing; Biomembranes; Costs; Electrostatics; Implants; Ion beams; Ion implantation; Lithography; Resists; Semiconductor device manufacture;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/TSM.2002.804923

Filename

1134162