DocumentCode :
949435
Title :
Radiation effects in low dielectric constant methyl-silsesquioxane films
Author :
Petkov, Mihail P. ; Lynn, Kelvin G. ; Rodbell, Kenneth P. ; Volksen, Willi ; Miller, Robert D.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Volume :
49
Issue :
6
fYear :
2002
fDate :
12/1/2002 12:00:00 AM
Firstpage :
2724
Lastpage :
2728
Abstract :
The use of state-of-the-art microelectronic devices in space radiation environments faces new challenges with the adoption of low dielectric constant (low-k) materials as interlevel dielectrics. This is demonstrated in a preliminary study of methyl-silsesquioxane low-k films. We report radiation damage, induced by a 2 keV low-current-density (∼2×106 s-1 cm-2) positron beam, and observed by positron annihilation spectroscopy.
Keywords :
dielectric thin films; integrated circuit metallisation; permittivity; positron annihilation; radiation effects; space vehicle electronics; 2 keV; dielectric constant; interlevel dielectrics; low-k films; methyl-silsesquioxane films; positron annihilation spectroscopy; positron beam; radiation damage; radiation effects; space radiation environments; Dielectric constant; Dielectric materials; Electronics industry; Electrons; Ionizing radiation; Polymers; Positrons; Radiation effects; Space technology; Spectroscopy;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2002.805353
Filename :
1134211
Link To Document :
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