• DocumentCode
    950527
  • Title

    Development of the hybrid structure for the barrel module of the ATLAS silicon-microstrip tracker

  • Author

    Kohriki, Takashi ; Ikegami, Yoichi ; Akimoto, Takashi ; Hara, Kazuhiko ; Iwata, Y. ; Kato, Yoichi ; Kondo, Takahiko ; Nakano, I. ; Ohsugi, T. ; Shimma, Shuichi ; Takashima, R. ; Tanaka, R. ; Terada, Susumu ; Ujiie, Norihiko ; Unno, Yoshinobu

  • Author_Institution
    IPNS, High Energy Accelerator Organ., Ibaraki, Japan
  • Volume
    49
  • Issue
    6
  • fYear
    2002
  • fDate
    12/1/2002 12:00:00 AM
  • Firstpage
    3278
  • Lastpage
    3283
  • Abstract
    A novel hybrid structure for the barrel module of the ATLAS semiconductor tracker (SCT) is developed. The hybrid carries 12 bare readout chips totaling 1536 channels. A flexible copper-polyimide four-layer lamination is used as a basic circuit. The circuit is reinforced by two carbon-carbon bridges coated with Parylene polymer. The hybrid staffed by resistors, capacitors, and pitch-adaptors undergoes heat cycling and quality inspections. The hybrid after chip mounting and wire bonding is placed over the top and bottom sides of the module assembly with no direct contact to silicon sensors. The electrical, mechanical, as well as thermal performances of the module are proven to be excellent.
  • Keywords
    bridge circuits; capacitors; carbon; copper compounds; laminations; nuclear electronics; position sensitive particle detectors; readout electronics; resistors; silicon radiation detectors; ATLAS semiconductor tracker; ATLAS silicon-microstrip tracker; C; Parylene polymer; SCT; Si; bare readout chips; barrel module; capacitors; carbon-carbon bridges; chip mounting; flexible copper-polyimide four-layer lamination; heat cycling; hybrid structure; module assembly; pitch-adaptors; quality inspections; resistors; thermal performances; wire bonding; Assembly; Bonding; Bridge circuits; Capacitors; Flexible printed circuits; Inspection; Lamination; Polymer films; Resistors; Wire;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2002.805527
  • Filename
    1134316