Title :
A curved-beam bistable mechanism
Author :
Qiu, Jin ; Lang, Jeffrey H. ; Slocum, Alexander H.
Author_Institution :
Tyco Electron., Menlo Park, CA, USA
fDate :
4/1/2004 12:00:00 AM
Abstract :
This paper presents a monolithic mechanically-bistable mechanism that does not rely on residual stress for its bistability. The typical implementation of this mechanism is two curved centrally-clamped parallel beams, hereafter referred to as "double curved beams". Modal analysis and finite element analysis (FEA) simulation of the curved beam are used to predict, explain, and design its bistable behavior. Microscale double curved beams are fabricated by deep-reactive ion etching (DRIE) and their test results agree well with the analytic predictions. Approaches to tailor the bistable behavior of the curved beams are also presented.
Keywords :
beams (structures); finite element analysis; mechanical stability; micromechanical devices; modal analysis; sputter etching; DRIE; FEA simulation; MEMS; beam analysis; bistability; bistable structure; centrally-clamped parallel beams; compliant structure; curved beam; curved-beam bistable mechanism; deep-reactive ion etching; finite element analysis; microelectromechanical systems; microscale double curved beams; modal analysis; residual stress; structure optimization; Etching; Fabrication; Fasteners; Finite element methods; Geometrical optics; Micromechanical devices; Modal analysis; Optical modulation; Residual stresses; Shape;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2004.825308
