Title :
Equations for Estimating Wire Length in Various Types of 2-D and 3-D System Packaging Structures
Author :
Masaki, Akira ; Yamada, Minoru
Author_Institution :
Hitachi Ltd.,Tokyo
fDate :
6/1/1987 12:00:00 AM
Abstract :
Equations for estimating wire lengths in various types of two-dimensional (2-D) and three-dimensional (3-D) cell arrays are introduced´and applications of these equations are described. The singleplane packaging technique is compared with the stacked 2-D technique. The effect of increasing the number of edge connectors for Stacked 2-D designs is evaluated. Also the wire length in 3-D wafer computers is estimated.
Keywords :
Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; Logic arrays; Wiring; Application software; Circuits; Connectors; Delay effects; Delay systems; Equations; Large scale integration; Packaging machines; Two dimensional displays; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1987.1134737
