DocumentCode
951363
Title
Stiffness and Yielding in the PLCC "J" Lead
Author
Gee, Stephen A. ; Van Kessel, Cees G M
Author_Institution
Philips Labs,Sunnyvale, CA
Volume
10
Issue
3
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
379
Lastpage
390
Abstract
The stiffness of the "J" lead in plastic leaded chip carrier (PLCC) packages is calculated using simple beam bending theory. These results are compared with experimentally determined values and used to estimate shear stress amplitudes in the solder joint. Yielding loads in "J" leads of varying geometries are also determined.
Keywords
Integrated circuit mechanical factors; Integrated circuit packaging; Surface mounting; Amplitude estimation; Geometry; Lead; Manufacturing; Plastic packaging; Printed circuits; Soldering; Surface-mount technology; Thermal expansion; Thermal stresses;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134743
Filename
1134743
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