New Film Carrier Assembly Technology: Transferred Bump TAB

Conventional tape automated bonding (TAB) uses IC chips with gold bumps, where gold bumps are formed on the aluminum bonding pads of the IC chips by metal evaporation, photoetching, and gold plating. The bumps of metal multilayer have to be formed directly on the IC chips in the conventional TAB method, and this necessitates a number of complicated processes and equipments. With the newly developed film carrier assembly technology, the bumps are prepared separately on a substrate and are transferred and bonded on the finger lead ends beforehand, therefore the assembly of IC chips can be made very simple and the assembly cost reduced.