DocumentCode :
951610
Title :
Foreword
Author :
Angevine, A. ; Panousis, N.
Author_Institution :
IBM Corporation
Volume :
10
Issue :
3
fYear :
1987
fDate :
9/1/1987 12:00:00 AM
Firstpage :
302
Lastpage :
302
Keywords :
Bonding; Electronics packaging; Manufacturing automation; Manufacturing processes; Materials reliability; Paper technology; Process control; Pulp manufacturing; Sampling methods; Surface-mount technology;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1987.1134767
Filename :
1134767
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=951610
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