DocumentCode
951801
Title
Shear Stress Evaluation of Plastic Packages
Author
Edwards, Darvin R. ; Heinen, K. Gail ; Groothuis, Steven K. ; Martinez, Jesus E.
Author_Institution
Texas Instruments Inc.,TX
Volume
10
Issue
4
fYear
1987
fDate
12/1/1987 12:00:00 AM
Firstpage
618
Lastpage
627
Abstract
A study has been performed to determine the impact of package assembly on shear stress phenomena in plastic encapsulated integrated circuits (IC´s). Test structures were used which allowed quantitative measurements of compressive stresses along with qualitative observation of shear Stress effects. Results from experiments with various mold compounds, lead frame materials, and mount compounds Will be presented. The experiments led to the development of a simplified stress model which can be applied to evaluating package and chip designs of future products.
Keywords
Integrated circuit mechanical factors; Integrated circuit packaging; Stress measurement; Assembly; Chip scale packaging; Circuit testing; Compressive stress; Integrated circuit measurements; Lead compounds; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device measurement; Stress measurement;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134785
Filename
1134785
Link To Document