DocumentCode :
951822
Title :
High-Density Multipin Connector for High-Speed Pulse Propagation
Author :
Inagaki, Shuichiro ; Nakano, Ken-ichi
Author_Institution :
NTT Electrical Communications Lab.,Japan
Volume :
10
Issue :
4
fYear :
1987
fDate :
12/1/1987 12:00:00 AM
Firstpage :
496
Lastpage :
501
Abstract :
A Procedure for designing connectors suitable for gigabit per second (Gbit/s) rate pulse propagation is presented. A design chart for a multipin connector satisfying both electrical and mechanical requirements is obtained. The design procedure is as follows. First, the effect of varying the arrangement of ground contact springs on characteristic impedance is investigated using the finite-element method. Next, the effect of varying contact spring size and contact spring pitch is analyzed with respect to characteristic impedance and crosstalk. Finally, a design chart is constructed for the multipin connector by combining the mechanical characteristics of the contact springs with the aforementioned electrical characteristics. Based on the resulting design chart, a prototype multipin connector for a pin grid array is fabricated. The empirically derived electrical characteristics of the prototype connector are in good agreement with those predicted analytically.
Keywords :
Connectors; Electromagnetic transient propagation; Capacitance; Connectors; Contacts; Crosstalk; Electric variables; Electromagnetic propagation; Electronics packaging; Impedance; Prototypes; Springs;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1987.1134787
Filename :
1134787
Link To Document :
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