DocumentCode :
951966
Title :
Foreword
Author :
Palkuti, L.
Volume :
10
Issue :
4
fYear :
1987
fDate :
12/1/1987 12:00:00 AM
Firstpage :
481
Lastpage :
481
Keywords :
Bonding; Capacitors; Ceramics; Connectors; Electronic components; Electronic packaging thermal management; Electronics packaging; Glass; Hybrid integrated circuits; Microwave devices;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1987.1134801
Filename :
1134801
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=951966
