DocumentCode
952072
Title
Optimum Design of Medium-Power Transistor Heat Sinks
Author
Tramposch, H.
Author_Institution
AMF Corporation
Volume
10
Issue
2
fYear
1963
fDate
6/1/1963 12:00:00 AM
Firstpage
94
Lastpage
100
Abstract
Theoretical expressions were developed for the thermal resistance of finned, medium-power transistor heat sinks which are mounted on printed-circuit boards, with part of the cooling air free to by-pass over other components of the board. Optimizing these expressions, the fin number that will give the lowest thermal resistance for given conditions within a logic gate can be obtained. Theoretical results were in good agreement with experimental data, and indicated that, within the range of practical applications, thermal resistance of double-finned heat sinks is independent of the number of fins.
Keywords
Cooling; Heat sinks; Heat transfer; Logic circuits; Logic gates; Printed circuits; Resistance heating; Surface resistance; Temperature; Thermal resistance;
fLanguage
English
Journal_Title
Component Parts, IEEE Transactions on
Publisher
ieee
ISSN
0097-6601
Type
jour
DOI
10.1109/TCP.1963.1134813
Filename
1134813
Link To Document