DocumentCode
952222
Title
The Bonding Characteristics of Gold in Ultrahigh Vacuum
Author
Cuthrell, Robert E. ; Tipping, Donald W.
Author_Institution
Sandia Lab.,Albuquerque,N. Mex
Volume
10
Issue
1
fYear
1974
fDate
3/1/1974 12:00:00 AM
Firstpage
4
Lastpage
10
Abstract
The results are reported of a study of the factors which affect the solid-phase bonding of gold wire electrical leads. Gold surfaces were cleaned by sputtering and joined with precise control of mechanical and environmental variables. Contact resistance measurements as a function of load, coefficients of adhesion, and laser interference fringe photo-microtopographs were used as diagnostics to show the effects of cleaning, annealing, loading, and creep. Ultrahigh vacuum techniques and vibration isolation were essential to reproducibly forming and measuring the strengths of solid-phase bonds between gold samples and between gold and tungsten.
Keywords
Contact materials; Metal-insulator-semiconductor structures; Thermocompression bonding; Ultrasonic bonding; Vacuum effects; Bonding; Contact resistance; Electric variables control; Electrical resistance measurement; Gold; Mechanical variables control; Sputtering; Surface resistance; Vibration measurement; Wire;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1974.1134828
Filename
1134828
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