DocumentCode :
952405
Title :
Electrical properties of silicon-implanted furnace-annealed silicon-on-sapphire devices
Author :
Roulet, M.E. ; Schwob, P. ; Golecki, I. ; Nicolet, M.-A.
Author_Institution :
Centre Electronique Horloger SA, Neuchâtel, Switzerland
Volume :
15
Issue :
17
fYear :
1979
Firstpage :
527
Lastpage :
529
Abstract :
The crystalline quality of s.o.s. layers can be improved near the silicon-sapphire interface by silicon implantation followed by recrystallisation. Device performance on such layers is markedly improved as to n-channel m.o.s.t. noise and leakage current, reverse diode current and lateral bipolar transistor gain. Minority-carrier lifetimes up to 50 ns are deduced.
Keywords :
annealing; bipolar transistors; electron device noise; insulated gate field effect transistors; integrated circuit technology; ion implantation; semiconductor diodes; semiconductor epitaxial layers; 50 ns minority carrier lifetime; SOS layers crystalline quality improvement; Si implanted furnace annealed SOS devices; Si sapphire interface; electrical properties; lateral bipolar transistor gain; leakage current; n-channel MOS transistor noise; reverse diode current;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19790380
Filename :
4243501
Link To Document :
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