• DocumentCode
    952409
  • Title

    Foreword: Special Issue on Hybrid Microelectronics

  • Author

    Clark, Robin

  • Author_Institution
    Adv. Microwave Dev. Group
  • Volume
    10
  • Issue
    2
  • fYear
    1974
  • fDate
    6/1/1974 12:00:00 AM
  • Firstpage
    87
  • Lastpage
    87
  • Keywords
    Hybrid integrated circuits; Application software; Electromagnetic heating; Fabrication; Hybrid integrated circuits; Microelectronics; Nonhomogeneous media; Packaging; Substrates; Thick films; Thin film inductors;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1974.1134846
  • Filename
    1134846
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=952409