• DocumentCode
    952591
  • Title

    New Alumina Substrate for Hybrid Integrated Circuits

  • Author

    Niwa, Koichi ; Nakamura, Jun´ichi ; Murakawa, Kyohei ; Nakamura, Masahi

  • Author_Institution
    Fujitsu Labs, Ltd., Kawasaki, Japan
  • Volume
    10
  • Issue
    4
  • fYear
    1974
  • fDate
    12/1/1974 12:00:00 AM
  • Firstpage
    262
  • Lastpage
    266
  • Abstract
    A new alumina substrate with an extremely smooth surface was developed. This new alumina substrate includes Cr203and MgO as the additives. Reliability data and characteristics of tantalum nitride or tantalum and tantalum oxide films on the new substrate were compared with those on the glazed alumina.
  • Keywords
    Ceramic materials; Hybrid integrated circuits; Thin-film capacitors; Thin-film resistors; Capacitors; Ceramics; Chromium; Electronic components; Gold; Hybrid integrated circuits; Physics; Substrates; Temperature; Transistors;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1974.1134864
  • Filename
    1134864