DocumentCode
952591
Title
New Alumina Substrate for Hybrid Integrated Circuits
Author
Niwa, Koichi ; Nakamura, Jun´ichi ; Murakawa, Kyohei ; Nakamura, Masahi
Author_Institution
Fujitsu Labs, Ltd., Kawasaki, Japan
Volume
10
Issue
4
fYear
1974
fDate
12/1/1974 12:00:00 AM
Firstpage
262
Lastpage
266
Abstract
A new alumina substrate with an extremely smooth surface was developed. This new alumina substrate includes Cr203and MgO as the additives. Reliability data and characteristics of tantalum nitride or tantalum and tantalum oxide films on the new substrate were compared with those on the glazed alumina.
Keywords
Ceramic materials; Hybrid integrated circuits; Thin-film capacitors; Thin-film resistors; Capacitors; Ceramics; Chromium; Electronic components; Gold; Hybrid integrated circuits; Physics; Substrates; Temperature; Transistors;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1974.1134864
Filename
1134864
Link To Document