Flat packaging of magnetic bubble devices

This paper describes a new method of packaging of a bubble device using, "flat-faced-coil (FFC)" drive coils, which simplify bubble device construction and facilitate easy heat radiation from the coils. The construction of the bubble drive coils is very important, because it determines the bubble device assembly process and the thermal dissipation of the coils. The FFCs sandwich the bubble chips. On the other hand, solenoid coils usually wrap around the bubble chips. As the FFC creates no large obstacles, it is easy to remove bubble chips from the coils as required. There is also excellent accessibility when wiring from the bubble chips to the electronic circuits.