Title :
Low-cost multichip modules
Author :
Dobers, Michael ; Seyffert, Martin ; Hauschild, Frank D. ; Czaya, Claus-Peter
Author_Institution :
Blaupunkt-Werke GmbH, Hildesheim, Germany
fDate :
9/1/1995 12:00:00 AM
Abstract :
We developed a new type of laminate-based multichip module, the interface of which to the next higher system level is a ball grid array. The modules contain both integrated circuits and passive components like chip capacitors and resistors. The protection of the IC´s is offered by a plastic cap which is glued to the substrate. We consider conceptional questions, the construction of the modules, and the actual status of qualification
Keywords :
laminates; microassembling; multichip modules; IC protection; ball grid array; integrated circuits; laminate-based MCM; low-cost multichip modules; passive components; plastic cap; qualification status; Assembly; Capacitors; Costs; Electronics packaging; Lead; Multichip modules; Production; Qualifications; Resistors; Soldering;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
