Title :
Quick inspection of power-plane short fault on multilayer substrate
Author :
Chao, Fang-Lin ; Wu, Ruey-Beei
Author_Institution :
Electron. Res. & Service Org., Ind. Technol. Res. Inst., Hsinchu, Taiwan
fDate :
9/1/1995 12:00:00 AM
Abstract :
A quick inspection approach for finding the powerplane short fault on multichip modules is proposed in this paper. The current source is applied on two diagonal corners of the power plane. The location of the short fault can be determined by as few as four voltage measurements. Also, the sheet conductivity of the power plane can be obtained as a by-product. Experiments have been performed and the successful prediction of the exact short point validates the present inspection approach
Keywords :
fault location; inspection; integrated circuit testing; multichip modules; production testing; voltage measurement; MCM; multichip modules; multilayer substrate; power-plane short fault; powerplane short; quick inspection; sheet conductivity; voltage measurements; Chaos; Circuit faults; Conductivity; Costs; Inspection; Integrated circuit measurements; Multichip modules; Nonhomogeneous media; Switching circuits; Voltage measurement;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
