• DocumentCode
    953357
  • Title

    A Correlation of Material Toughness, Thermal Shock Resistance, and Microstructure of High Tungsten, Silver-Tungsten Composite Materials

  • Author

    Witter, Gerald J. ; Warke, William R.

  • Author_Institution
    Fansteel Inc., IL
  • Volume
    11
  • Issue
    1
  • fYear
    1975
  • fDate
    3/1/1975 12:00:00 AM
  • Firstpage
    21
  • Lastpage
    29
  • Abstract
    The electrical erosion resistance of composite silver-tungsten materials seems to improve with finer dispersions of the silver and tungsten; however, these materials with the finer dispersions exhibit a higher tendency to fail by catastrophic crack propagation during arc erosion testing. A fracture mechanics approach is taken to determine Gfc, the critical strain .energy release rate for crack extension under plane strain conditions for several compositions and particle size distributions of silver-tungsten materials. A qualitative analysis of resistance to crack propagation in the same materials under severe arcing agrees with the Glc measurements. The fracture toughness of these materials has also been compared to the microstructure by quantitative metallography. A relationship of Glcand the mean free path between tungsten particles has been found to agree on only a porton of the materials. A more complex term involving contiguity, volume fraction silver and mean free path has a good correlation with Glc for all the materials.
  • Keywords
    Contacts, mechanical factors; Silver alloys/compounds, devices; Tungsten alloys/compounds, devices; Capacitive sensors; Composite materials; Electric resistance; Electric shock; Electrical resistance measurement; Materials testing; Microstructure; Silver; Thermal resistance; Tungsten;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1975.1135028
  • Filename
    1135028