DocumentCode
953357
Title
A Correlation of Material Toughness, Thermal Shock Resistance, and Microstructure of High Tungsten, Silver-Tungsten Composite Materials
Author
Witter, Gerald J. ; Warke, William R.
Author_Institution
Fansteel Inc., IL
Volume
11
Issue
1
fYear
1975
fDate
3/1/1975 12:00:00 AM
Firstpage
21
Lastpage
29
Abstract
The electrical erosion resistance of composite silver-tungsten materials seems to improve with finer dispersions of the silver and tungsten; however, these materials with the finer dispersions exhibit a higher tendency to fail by catastrophic crack propagation during arc erosion testing. A fracture mechanics approach is taken to determine Gf c, the critical strain .energy release rate for crack extension under plane strain conditions for several compositions and particle size distributions of silver-tungsten materials. A qualitative analysis of resistance to crack propagation in the same materials under severe arcing agrees with the Gl c measurements. The fracture toughness of these materials has also been compared to the microstructure by quantitative metallography. A relationship of Gl c and the mean free path between tungsten particles has been found to agree on only a porton of the materials. A more complex term involving contiguity, volume fraction silver and mean free path has a good correlation with Gl c for all the materials.
Keywords
Contacts, mechanical factors; Silver alloys/compounds, devices; Tungsten alloys/compounds, devices; Capacitive sensors; Composite materials; Electric resistance; Electric shock; Electrical resistance measurement; Materials testing; Microstructure; Silver; Thermal resistance; Tungsten;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1975.1135028
Filename
1135028
Link To Document