Title :
Coarse and detailed CFD modeling of a finned heat sink
Author :
Linton, Ronald L. ; Agonafer, Dereje
Author_Institution :
Risc Syst./6000 Div., IBM Corp., Austin, TX, USA
fDate :
9/1/1995 12:00:00 AM
Abstract :
CFD modeling of electronic components becomes increasingly more important as CFD spreads into the design process. This paper compares the results of a detailed CFD model of a heat sink with experimental data. Then a technique for representing the heat sink in a coarse manner in a CFD model is presented and compared with the detailed CFD model. Agreement is quite good, indicating that this technique can be used when representing heat sinks in larger card or system models
Keywords :
fluid dynamics; heat sinks; packaging; thermal resistance; CFD modeling; PHOENICS; card model; card on board packages; coarse model; computational fluid dynamics; electronic components; finned heat sink; pressure drop; system model; thermal resistance; Bonding; Computational fluid dynamics; Equations; Heat sinks; Heat transfer; Packaging; Power system modeling; Solid modeling; Temperature; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
