Title :
Thermap: a thermal model for microprocessors
Author :
Fitch, John S. ; Monier, Louis ; Tamet, Hervé
Author_Institution :
Digital Equipment Corp., Palo Alto, CA, USA
fDate :
9/1/1995 12:00:00 AM
Abstract :
Thermap is a numerical model that predicts the steady-state temperature of a multilayered stack of materials, which might include voids. Heat flux and temperature can be prescribed at any node. Thermap gathers the heat flux boundary descriptions from a VLSI CAD tool in order to simulate a microprocessor. This can be done with very fine spatial resolution. Thermal conductivities can be temperature dependent. Residual iteration, grid refinement, and efficient use of data structures allow Thermap to converge quickly. A graphical server called ezd is used to view the resulting images of power or temperature. Thermap´s temperature predictions are compared with an infrared measurement of a real microprocessor
Keywords :
VLSI; circuit CAD; data structures; engineering graphics; integrated circuit modelling; integrated circuit packaging; iterative methods; microprocessor chips; temperature distribution; thermal analysis; thermal conductivity; Thermap; VLSI CAD tool; data structures; ezd graphical server; grid refinement; heat flux boundary descriptions; microprocessors; multilayered materials stack; numerical model; residual iteration; steady-state temperature; temperature predictions; thermal conductivity; thermal model; voids; Conducting materials; Data structures; Image converters; Microprocessors; Numerical models; Spatial resolution; Steady-state; Temperature dependence; Thermal conductivity; Very large scale integration;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
